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Resin Technology

Resin Technology

Leveraging on our cordial relationship with NTL Chemical Consulting of Greece, we provide hassle free and the most upgraded Resin Technology Solution in India. We have done adequate R&D before developing Formaldehyde Resin Technology Solution for our clients so that they can make the most out it. Our fabricated Resin Technology Plant are best known for their salient features like Increased cost efficiency, Cutting edge resin process, Enhanced competitiveness and many more.

Advantages of using our Resin Technology:-

  • Cost-effective formaldehyde-based Resin Technology Systems

  • Customized/Tailor-made Resin Technology

  • Environment friendly

  • Innovative and continuous research and development

  • Meets all International Standards

  • Meets E1, E0 or Super E0 emission norms, without addition of melamine to boards which represents substantial cost reductions

  • Resin design to optimize viscosity, solids content, tackiness, dry out and emission properties of the wood panel boards

  • Significant cost-saving benefits with production and board process unchanged

  • Tailor-made, cost-effective and optimum performance resin technology solution

Backed by a dexterous team of best process engineers, we believe in going out of the box to help our clients selecting the right Resin, coupling agent, catalyst, demolding agent, low profile additive, filler and several other useful products. We offer our clients a low cost formaldehyde solution with specifications which is in sync with clients' requirements.


Resin Technology products comprises:


(PB) - Particleboards

  • Additives: Activators, Scavengers and Special Hardeners

  • Resins: UF, UMF, MUF or MUPF or PF, for E2, E1, E0 and super E0 boards

MDF - Boards

  • Additives: Activators or Cross-linkers

  • Resins: UF, UMF, MUF for E2, E1, E0 and Super E0 board production

Scavengers and Latent Hardeners

Plywood-Boards

  • Additives: Hardeners

  • Amino based resins: UF, UMF, MUF or MUPF for E2, E1 and E0 boards

  • Phenolic resins: PF fast curing and low cost

Impregnation Technology

  • Additives: UF-Hardener, Latent hardener, plasticizer, modifier

  • UF and MF for low pressure laminates as well as per post forming

Particleboard Lines

Short Cycle Laminating

  • POM (Polyacetal)
  • TMP (Trimethyolpropane)
  • NPG (Neopentyl Glycol)
  • Para-Formaldehyde
  • Pentaerythritol
  • MIBK (METHYL ISOBUTYL KETONE)
  • PA (Phthalic Anhydride)
  • MA (Maleic Anhydride)
  • Ethanolamines
  • Phenol & Acetone
  • BPA (Bisphenol A)
  • PTA (Terephthalic Acid)
  • H2o2 (Hydrogen Peroxide)
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